Method and structure for reducing leakage currents of active area diodes and source/drain diffusions

ABSTRACT

A fabrication method for providing isolation between adjacent regions of an integrated circuit includes providing a guard layer over field edges that are the interfaces between field oxide regions and diffusion regions in which dopant is introduced. The guard layer will inhibit introduction of dopant along the field-edge, so that a substantially dopant-free transition strip is formed. The transition strip inhibits current leakage from the active region to the field oxide region. In one embodiment, the active region is an active area diode, such as used to form an Active Pixel Sensor (APS) pixel. The guard layer is biased so as to further inhibit current leakage during circuit operation. In another embodiment, the method is used in the fabrication of transistors for APS pixels having an overlay photodiode structure.

TECHNICAL FIELD

[0001] The invention relates generally to methods for providingisolation between adjacent regions of an integrated circuit and moreparticularly to methods of reducing current leakage from an activeregion to a field oxide region in a circuit, such as an image sensorcircuit.

BACKGROUND ART

[0002] Complementary metal-oxide-semiconductor (CMOS) technology is usedin the design and fabrication of integrated circuits for many types ofapplications. CMOS technology uses n-type transistors (NMOS) and p-typetransistors (PMOS) that are formed by doping selected regions of asubstrate and by forming layers on the substrate. A p-type material,such as boron, may be introduced to a bulk silicon substrate in ablanket ion implantation step. Field oxide regions and n-type regionsmay then be formed using well known integrated circuit fabricationtechniques. Similarly, the processes for depositing conductive anddielectric layers on the substrate to complete the circuit are known.

[0003] One general area for applying CMOS technology that has receivedsignificant attention is image capture and processing. Imagingapplications include video, still photography, and navigation that isbased upon optical detection. Linear or two-dimensional arrays of pixelsare formed along the surface of the substrate, with each pixelperiodically generating a signal having a current or voltage level thatis indicative of the intensity of light incident to that pixel. Atypical three-transistor pixel 10 that is used in current CMOS imagesensors is shown in FIG. 1. Sensors that use this technology are oftenreferred to as CMOS active pixel sensors (APS). A timing diagram for theoperation of the three-transistor pixel 10 is shown in FIG. 2. Intypical operation, a node N1 is set to a predetermined voltage V_(dd′))(which may be different than the circuit operating voltage V_(dd)) byturning on an n-channel reset transistor 12. The state of the resettransistor is determined by controlling a reset voltage (V_(reset)). InFIG. 2, V_(reset) goes high at time T0, causing the node N1 to ramp toV_(dd′). At time T1, the reset transistor 12 is turned off andphotoelectrons are generated by the incident light on a photodiode 14.The photoelectrons are injected into node N1, reducing the voltage onthat node by a value ofV_(sense)=V_(dd′)−(I_(photo)×T_(illuminate)/C_(N1)). In this equation,I_(photo) is the photocurrent induced by the incident light,T_(illuminate) is the illumination time period and C_(N1) is thecapacitance on node N1. Both V_(dd′) and V_(sense) can in principle beread out of the pixel through a source-follower 16 by activating arow-select transistor 18. In a two-dimensional array of pixels, theretypically are row-select transistors and column-select transistors thatallow the pixels to be sequentially sampled. The row-select transistor18 is activated by manipulating a row-select (RS) signal. Theillumination on the pixel is then proportional toV_(dd′)−V_(sense)=I_(photo)×T_(illuminate)/C_(N1). Persons skilled inthe art refer to this operation as Correlated Double Sampling (CDS).Sampling occurs at time T2 before T_(illuminate) and time T3 duringT_(illuminate). The pixel is reset at time T4, since V_(reset) is causedto go high.

[0004] One of the major problems of using CMOS technology in imagingsensors is the relatively large dark current intrinsic to the CMOSprocess. A significant cause of the large dark current is thereverse-bias diode leakage in the photodiode 14 of a pixel, as well asin the source diffusion of the MOS field effect transistor (MOSFET) 12connected to the photodiode. The diode leakage is often dominated by theedge leakage currents. Furthermore, in deep-submicron generations ofCMOS technology, this leakage current will only increase and take majorengineering efforts to suppress.

[0005] The physical layout of the CMOS APS pixel 10 of FIG. 1 will bedescribed with reference to FIGS. 3, 4 and 5. FIG. 3 is a top view ofthe circuit layout of the APS pixel of FIG. 1, showing the variouslayers and diffusion regions. FIG. 4 is a top view that isolates theactive area diode of FIG. 3, while FIG. 5 is a side sectional view ofFIG. 4. The active area diode is illustrated as being an n+/p diodefabricated in a p-substrate or p-well. However, the descriptions of theoperations and problems apply equally to a p+/n diode in an n-substrateor n-well. The pn-junction of the diode 14 is defined by the p-substrateor p-well 20, which will be referred to as the p-layer. Electricalconnections 22 and 24 to the diode are formed by depositing layers thatare in contact with an n+ region 26 and a p+ region 28, respectively.The n+ region 26 may be formed by ion implantation or other dopingtechniques into the active area that is identified as the photodiode 14in FIG. 3. The active area is delineated by a field oxide (FOX) region30. Typically, the FOX region is a thick layer of silicon dioxide (SiO₂)that electrically isolates the active area from other regions of thesubstrate, which is typically a silicon substrate. There are severalwell known processes for forming the FOX. Any of the processes may beused to form the FOX of FIGS. 3-5. However, each of the known processesis susceptible to the formation of a high density of defects at theedges of the FOX. The defects are primarily due to mechanical stresseffects and contamination. The high density of defects located withinthe pn-junction diode's depletion region contributes to the highreverse-bias leakage current found at the field-edge of the diode. Therehas been much research and development regarding providing process steps(such as oxide deposition, etching and annealing) that minimize the edgeleakage. However, the edge leakage problem is expected to become worseas the CMOS process is applied at the deep-submicron level.

[0006] Referring specifically to FIGS. 1 and 3, the gates of the threetransistors 12, 16 and 18 are formed by a patterned polysilicon layer.The polysilicon layer is identified by hatching in FIG. 3. The resettransistor 12 has a gate 32, the row-select transistor 18 has a gate 34,while the transistor 16 has a gate 36 that is electrically coupled tothe N1 node 22. The source/drain regions of the three transistors areformed by diffusions using the appropriate dopants. As can be seen inFIGS. 1 and 3, the transistors 16 and 18 have source/drain regions thatare formed by a common diffusion region 38.

[0007] Dark current in the CMOS APS pixel 10 with an active areaphotodiode 14 is caused mainly by the photodiode leakage, which bleedscharge from the node 22 (N1). This reduces the voltage on the node, evenwhen the reset transistor 12 is turned off during the illumination timeT_(illuminate). Therefore, the diode leakage produces an offset in thedifferential voltage produced by the illumination, given byV_(dd′)−(I_(photo)+I_(dark))×T_(illuminate)/C_(N1). For low lightillumination, it is possible for I_(dark) to be approximately the sameas I_(photo). Thus, the dark current limits the dynamic range of theimage sensor. Dark current reduction has usually been addressed byattempting to lower the intrinsic diode leakage of the CMOS technologyvia processing steps. This minimization of the diode leakagecharacteristics is very difficult in advanced deep-submicron CMOStechnologies that use advanced field oxide formation techniques and havemuch higher doping concentrations in the diode.

[0008] Field-edge leakage can also be a significant problem at thetransistor level of the pixel 10. Each of the three MOSFETs 12, 16 and18 is formed by growing a thin gate oxide over the active area of thetransistor and then forming the gates 32, 34 and 36 by patterning stripsof polysilicon over the thin gate oxide. The n+ dopant is implantedafter the gates have been formed. For each transistor, two separate n+/pdiodes are then simply the source and drain diffusions in combinationwith the p+ contact. Because the source and drain diffusions aredelineated by field oxides on three sides, they have the same field-edgeleakage problem as the isolated n+/p diode.

[0009] There have been attempts to isolate active components of twocomplementary transistors. One such attempt is described in U.S. Pat.No. 5,847,433 to Kerber, which is not related to imaging applications.In order to produce isolated active regions of a CMOS circuit, a fieldplate is formed and doped jointly with wells located between the fieldplate. Therefore, the field plate includes an n-doped region and ap-doped region, as well as a boundary region between the two dopedregions. Each doped region is electrically connected to the well that islocated beneath it. As a result, a flat band condition prevails at thesubstrate surface. While the Kerber method provides an improvement, darkcurrent leakage is still a problem, particularly in imagingapplications.

[0010] What is needed is an integrated circuit fabrication method thatis applicable to imaging applications and that provides furtherreductions in the edge leakage component of diodes and source/draindiffusions of MOSFETs.

SUMMARY OF THE INVENTION

[0011] A fabrication method for providing isolation between regions ofan integrated circuit includes forming a guard layer on a peripheralportion of at least one of two adjacent regions of a substrate, so thatwhen dopant is introduced into the substrate, an intermediate transitionstrip is left substantially dopant-free. The transition strip inhibitscurrent leakage from an active region to an adjacent region, which ispreferably a field oxide region. In the preferred embodiment, the activeregion is an active area diode, such as the one used in an Active PixelSensor (APS) pixel. Also in the preferred embodiment, the guard layer isa conductive material that is connected to a source of a bias voltage.For an APS pixel, the biased guard layer blocks the doping of the activearea diode during fabrication and effectively blocks edge leakagecurrent during circuit operation, as long as the guard layer is biasedbelow the threshold voltage of the MOS system in which it is formed. Theuse of some process technologies will require bias in accumulation.

[0012] In one embodiment, the guard layer is formed of a patternedconductive material (such as polysilicon) on the peripheral portion ofthe active region. The guard layer extends across the peripheral portionto at least the edge of the adjacent field oxide region. Optionally, theguard layer extends onto a peripheral portion of the field oxide region,thereby relaxing the alignment tolerances. The overlap of the guardlayer onto the active area will depend upon factors such as thealignment specifications of the photolithography tools used in thefabrication technology, but will typically be about the same as theoverlap of the guard layer onto the field oxide region, if such anoverlap is utilized. Since depositing polysilicon is a standard part ofa CMOS circuit, such a modification of the existing active area diode isrelatively simple to accomplish.

[0013] In an alternative application, the guard layer is patternedconductive material that extends along the interface between asource/drain region of a MOSFET and a field oxide region. Thedopant-free transition strip that is formed by using the guard layer asa shield in a subsequent step of introducing dopant into thesource/drain region isolates the doped region from the field oxideregion. In this embodiment, the guard layer is preferably formed ofpolysilicon and is simultaneously formed with and connected to the gateof the MOSFET. When the gate is biased to a high voltage (i.e., theMOSFET is turned on), there will be an inversion layer generated underthe guard layer, thereby extending along the interface of thesource/drain region and the field oxide edge. Optionally, the guardlayer may be patterned about both of the source/drain regions.Connecting the polysilicon guard layer to the gate of the MOSFET hasadvantages with regard to fabrication simplicity. However, the practicemay result in an unacceptable leakage level (due to the gate-edgeleakage) and/or an unacceptable increase in source/drain capacitance. Inaddition, because of the standard overlap of the gate region onto thesource/drain regions, gate-to-source/drain capacitance will increase. Ifthe extra leakage or capacitance is problematic, it is possible toseparate the gate polysilicon from the polysilicon guard layer. In thiscase, the polysilicon guard layer should be biased by another contact.

[0014] In a third embodiment, the guard layer is used for MOSFETs thatshare diffusions. MOSFETs that share a common diffusion are often usedin CMOS circuits to lower the total layout area. By depositing the guardlayer along the interface between an adjacent field oxide region and acommon diffusion region, edge leakage is reduced. In this embodiment,the guard layer may be connected to one of the gates of the two MOSFETs,but not both, unless the two gates are tied to the same circuit node.For applications in which the two transistors are operated separately,the guard layer may be connected to one of the two gates or may beconnected to a separate contact.

[0015] An advantage of the invention is that depositing the guard layerprior to introducing the dopant into an active region provides controlover edge leakage without significantly diverging from existingfabrication techniques. In the preferred embodiment, the guard layer isformed of polysilicon that is formed at the same time as the gates ofthe transistors. The guard layer has the same thickness as the gates andpreferably has the same width, but this is not critical.

BRIEF DESCRIPTION OF THE DRAWINGS

[0016]FIG. 1 is a schematic of a three-transistor CMOS Active PixelSensor (APS) pixel for use in imaging applications.

[0017]FIG. 2 is a timing diagram for the three signals controlled in theoperation of the APS pixel of FIG. 1.

[0018]FIG. 3 is a top view of a prior art circuit layout of layers anddiffusion regions for forming the APS pixel of FIG. 1.

[0019]FIG. 4 is a top view of a simplification of the photodiode of theAPS pixel of FIGS. 1 and 3.

[0020]FIG. 5 is a side sectional view of the photodiode of FIG. 4, takenalong lines 5-5.

[0021]FIG. 6 is a top view of a circuit layout of layers and diffusionregions for forming the APS pixel of FIG. 1, but with a leakage-controlguard layer in accordance with one embodiment of the invention.

[0022]FIG. 7 is a top view of the photodiode of FIG. 6.

[0023]FIG. 8 is a side sectional view of the photodiode of FIG. 7, takenalong lines 8-8.

[0024]FIG. 9 is a top view of a simplification of a transistor inaccordance with the prior art.

[0025]FIG. 10 is a side sectional view of the prior art transistor ofFIG. 9, taken along lines 10-10.

[0026]FIG. 11 is a top view of the transistor of FIG. 9, but with aguard layer formed in accordance with an embodiment of the invention.

[0027]FIG. 12 is a side sectional view of the transistor of FIG. 11,taken along lines 12-12.

[0028]FIG. 13 is a top view of the transistor of FIG. 9, but with aguard layer in accordance with another embodiment of the invention.

[0029]FIG. 14 is a top view of a simplification of adjacent MOSFETs thatshare a common diffusion in accordance with the prior art.

[0030]FIG. 15 is a top view of one embodiment of forming a guard regionalong the common diffusion of FIG. 14 in accordance with the invention.

[0031]FIG. 16 is a top view of another embodiment of forming a guardlayer for the common diffusion of FIG. 14 in accordance with theinvention.

[0032]FIG. 17 is a top view of a circuit layout of layers and diffusionregions for forming an overlay photodiode in accordance with the priorart.

[0033]FIG. 18 is a side sectional view of the prior art device of FIG.17, taken along lines 18-18.

[0034]FIG. 19 is a top view of a circuit layout of the layers anddiffusion regions of FIG. 17, but with a guard layer in accordance withthe invention.

[0035]FIG. 20 is a side sectional view of the device of FIG. 19, takenalong lines 20-20.

[0036]FIG. 21 is a process flow of steps for forming the circuits inaccordance with the invention.

DETAILED DESCRIPTION

[0037] As previously noted, one of the major problems of using CMOStechnology in imaging sensors, such as those used in video, stillphotography and optical navigation, is that the CMOS process has arelatively large inherent dark current. One of the major causes of thelarge dark current is the reverse-bias diode leakage in the photodiode.This diode leakage is dominated in many cases by edge leakage currents.The invention that will be described with reference to FIGS. 6-8 willaddress this cause. Another cause is the reverse-bias diode leakage inthe source/drain diffusions of MOSFETs connected to the photodiode. Themeans of addressing this cause of the large dark current will thenfollow.

[0038] With reference to FIG. 6, the circuit layout that is shown isconsistent with the circuit layout of FIG. 3. However, a guard layer 40(shown as being hatched) has been incorporated into the fabrication ofthe photodiode 14. The guard layer is preferably formed of polysiliconat the same time that the three polysilicon gates 32, 34 and 36 areformed. Since the incorporation of the guard layer does not affect theschematic representation of the electrical circuit, the referencenumerals that were used in FIGS. 1 and 3 are also used in FIG. 6. Thepolysilicon guard layer 40 is formed before the dopant is introducedinto the active area of the photodiode. Therefore, the polysilicon guardlayer will block the n+ implant, leaving a transition strip below theportion of the guard layer that overlaps the region surrounded by thefield oxide 30.

[0039]FIGS. 7 and 8 correspond to FIGS. 4 and 5, but include thepolysilicon guard layer 40. The transition strip 42 that issubstantially dopant free can be seen in FIG. 8. The polysilicon guardlayer 40 is illustrated as being deposited on a portion of the gateoxide layer that is used in forming the gates of the three transistors.This provides further compatibility between the conventional steps offorming the transistor gates and the steps for forming the guard layer.However, other approaches may be utilized. For example, if the guardlayer 40 is to be allowed to have a “floating” potential, rather thanbeing biased, the portion of the gate oxide layer 41 below the guardlayer 40 may be eliminated. This would short the guard layer to the n+region 26.

[0040] As seen in FIG. 6, the guard layer 40 connects to the gate 32 ofthe reset transistor 12. During the illumination period, the gate of thereset transistor is at  volts (as indicated in the timing diagram ofFIG. 2). The bias of the guard layer provides a reduction in darkcurrent. For CMOS processes that do not exhibit the expected leakagecurrent reduction at  volts, it is possible to bias the guard layer 40at a lower voltage, so as to bring the underlying silicon intoaccumulation. This may be performed by separating the guard layer fromthe gate 32 and providing a separate electrical connection to a fixedsource of a negative voltage. Alternatively, the reset transistor 12 maybe driven to a negative gate voltage, rather than a  voltage. In eithercase, the simple circuit layout technique mitigates the need ofextensive and expensive technology development to ensure low darkcurrent in CMOS APS pixels 10.

[0041] During fabrication, the polysilicon guard layer 40 blocks theimplantation of dopant, as indicated by the transition strip 42 in FIG.8. During operation, the guard layer is biased below the thresholdvoltage of the MOS system in which it is formed. Consequently, the n+region 26 will be electrically and structurally isolated from the fieldoxide edge 30. It follows that the edge component of diode leakage willbe reduced. How much of a reduction of leakage current that is obtainedwill depend on the exact processing steps used to fabricate the diode14. This is because at a typical guard layer bias of  volts, there is adepletion region under the polysilicon that can still allow leakagecurrent as a result of field-edge defects. However, as noted above, ifleakage currents are not sufficiently reduced, it is possible to biasthe polysilicon so as to bring the underlying substrate region intoaccumulation. In this case, there should be no contribution to leakagefrom the field-edge defects.

[0042] The overlap of the guard layer onto the active area diode 14 willdepend upon the alignment specifications of the photolithography toolsused in the technology. Typically, the overlap will be approximately thesame as the overlap length of the guard layer onto the field oxideregion 30.

[0043] A comparison of FIGS. 5 and 8 shows that the use of the guardlayer 40 reduces the area of the n+ region 26. Consequently, thesensitivity to light will be reduced. If one wants to retain the sameactive diode area, the structure of the diode can be increased in size.

[0044] While the guard layer has been described as being formed ofpolysilicon, this is not critical. Other materials may be substituted.Preferably, the material is conductive, so that it can be biased belowthe threshold voltage of the MOS system. However, the use of adielectric guard layer provides some of the advantages of thepolysilicon guard layer, if it blocks the dopant implantation during thefabrication process. Also in the preferred embodiment, the guard layeris not removed after the dopant implantation step, but applications inwhich the guard layer is removed have been contemplated.

[0045] Similar to the active area diode, the MOSFET diffusions that formthe source/drain regions of the transistors can benefit from the use ofa guard layer over the field-edge that forms their boundaries. Theconventional MOSFET transistor is shown in FIGS. 9 and 10. A MOSFET 44is formed by growing a thin gate oxide 46 over the active area of thetransistor. A layer of polysilicon is then formed over the gate oxide 46by material deposition and pattern etching. This provides the gate 48 ofthe MOSFET. The source/drain regions 50 and 52 are then formed byimplantation of an n+ dopant that extends to a field oxide region 54.Contacts 56 and 58 may be patterned to reside on the source/drainregions. A p+ layer 60 is also shown in FIGS. 9 and 10.

[0046] As a result of the fabrication process, two separate n+/p diodes62 and 64 are formed, with the source/drain regions providing the n+contact and the substrate 66 providing the p contact. Because the sourceand drain diffusions are delineated on three sides by the FOX 54, theyhave the same field-edge leakage problem as the active area diodedescribed above. Referring now to FIGS. 11 and 12, the formation of thegate oxide 46 and the polysilicon that forms the gate 48 can be extendedto provide a guard layer 68 around the drain region 52 of the transistor44. While the illustration shows the guard layer as being applied onlyto the drain region, it is possible to achieve the same benefits for thesource region 50 if the guard layer is patterned over the edge of thesource region along the FOX 54. Optionally, the guard layer can beformed about both of the source/drain regions.

[0047] By forming the guard layer 68 prior to introducing the dopantinto the source/drain regions 50 and 52, a transition strip 70 that issubstantially free of dopant is formed at the edge of the FOX 54. Thisprovides the same advantages described with reference to FIGS. 4-8.Specifically, the edge component of the diode leakage is significantlyreduced. However, when the guard layer 68 is connected to the gate 48 inthe manner shown in FIG. 11, the bias of the gate to a high voltage (FETturned on) will create an inversion layer below the entire polysiliconto extend the n+ region 26 to the FOX 54. The result may be an increasedleakage (due to gate-edge leakage) and extra source/drain capacitance.In addition, because of the standard overlap of the gate onto thesource/drain regions, gate-to-source/drain capacitance is increased. Ifthe extra leakage or capacitance is problematic, it is possible toseparate the gate polysilicon 48 from the polysilicon material thatforms the guard layer. This embodiment is shown in FIG. 13. Preferably,the guard layer 72 of FIG. 13 is biased by connection to a fixed sourceof voltage (e.g.,  volts). The drain region 52 will have small links 74and 76 in which the diffusion region contacts the FOX 54, so as tocontribute to leakage current. The dimensions of the links 74 and 76will depend upon the spacing rule of the technology's polysilicon. Theextra leakage will be negligible for large MOSFETs.

[0048] The invention is also applicable to MOSFETs that sharediffusions. The conventional structure is shown in FIG. 14. A pair ofMOSFETs are shown in a side-by-side arrangement. The first transistorincludes a polysilicon gate 78 and a source region 80, while the secondtransistor includes a polysilicon gate 82 and a diffused source region84. The two transistors share a drain 86 diffusion. MOSFETs that share acommon diffusion are often used in CMOS circuits to lower the totallayout area.

[0049] Referring now to FIG. 15, the common drain 86 has reduced leakageas a result of a polysilicon guard 88 that is formed on opposite sidesof the common drain. In the embodiment of FIG. 15, the guard 88 isconnected to the second gate 82 in order to provide a bias. The guard isseparated from the first gate 78, so that the two gates are not shorted.Of course, if the gates are tied to a single circuit node, thepolysilicon guard 88 can be connected to both gates. This gate-to-gatecoupling is particularly useful for MOSFETs with multiple gate fingers.

[0050]FIG. 16 shows a modification of the embodiment of FIG. 15. In thisembodiment, the guard layer 90 is electrically separated from both ofthe gates 78 and 82. As previously noted, this approach may be used toreduce drain capacitance. The guard 90 of FIG. 16 is preferablyconnected to a source of a fixed voltage, such as electrical ground.

[0051] There are advantages to implementing a CMOS APS pixel 10 of thetype shown in FIG. 1 using a photodiode 14 that overlays the underlyingCMOS chip. One advantage is that the bulk photodiode is removed from thesubstrate, so that the only diode that can contribute to dark current isthe one formed by the source diffusion of the reset transistor, whichhas a much smaller area than the substrate embedded photodiode 14 ofFIG. 3. An exemplary circuit layout of an overlay photodiode arrangementis shown in the top view of FIG. 17 and the side sectional view of FIG.18. In the conventional approach, the reset transistor 12 is formedusing conventional techniques. As a result, a FOX region 92 andsource/drain regions 94 and 96 are formed in a substrate 98. A gateoxide layer 100 and the polysilicon gate 32 are patterned before ionimplantation forms the source/drain regions.

[0052] After the transistors 12, 16 and 18 are formed at the substratelevel, a dielectric layer 102 is deposited at the same level asformation of a pair of contacts 104 and 106 to the source/drain regions94 and 96. Other dielectric layers 108, 110 and 112 are formed, witheach level of dielectric material including a patterned metal 114, 116and 118, as well as a patterned contact 120, 122 and 124. The patternedmetal layers and contact layers form a via from the transistor 12 to anoverlay photodiode 126. Correlating FIGS. 17 and 18, the portion of themetal layer 114 that resides above the contact 106 (Cl) in FIG. 18 isthe node 22 (N1) in FIG. 17.

[0053] Although the source diffusion 96 of the reset transistor 12 isrelatively small, it may still induce a relatively large dark current,especially in advanced deep-submicron CMOS technologies and in fact maybe the largest contributor to dark current in the pixel. The approach ofproviding a polysilicon guard layer may be applied to the overlayphotodiode structure in order to address this possibility. Specifically,a guard layer of polysilicon may be formed over the field-edge of thesource diffusion in order to reduce dark current. Because the sourcediffusion 96 is a small portion of the total pixel area, adding theguard layer will result in only a small increase in pixel area. FIGS. 19and 20 illustrate the overlay photodiode with the diffusion-inhibitingguard layer 128 about the source diffusion 96. The guard layer is formedbefore the dopant is introduced into the source region. Therefore, atransition strip that is relatively free of dopant is formed between theFOX 92 and the source region 96. The transition strip 130 is illustratedin FIG. 20.

[0054] The steps for carrying out the invention will be describedbriefly with reference to FIG. 21. In step 132, a circuit layout isselected. In the preferred embodiment, the circuit layout defines layersof a CMOS imaging sensor having an array of APS pixels. The APS pixel 10of FIG. 1 is merely one example. The array of pixels may be linear ormay be two-dimensional.

[0055] In step 134, the field oxide regions are formed. Conventionaltechniques may be used to form these regions. The approach is notcritical to the invention.

[0056] A diffusion-inhibiting guard layer is formed over selected fieldedges, as shown at step 136. Some of the alternatives were described andillustrated above. Preferably, the guard layer is formed of polysiliconand is formed simultaneously with the gates of transistors.

[0057] The dopant is introduced into the appropriate regions at step138. The regions that are guarded by the guard layer that was formed instep 136 may be active area diode regions, source/drain diffusionregions, or both. The remainder of the circuit fabrication is thencompleted at step 140. The guard layer or guard layers are biased atstep 142 in order to inhibit edge leakage.

What is claimed is:
 1. A method of providing isolation between adjacentregions of an integrated circuit comprising the steps of: selecting acircuit layout for fabrication of said integrated circuit on asubstrate, including defining adjacent substrate locations for a firstregion and a second region for which leakage current from said secondregion to said substrate is undesired during operation of saidintegrated circuit, at least said second region being an active regionwithin which a dopant is to be introduced; forming a guard layer on saidsubstrate such that said guard layer resides on a peripheral portion ofsaid second region, said peripheral portion of said second regionextending along an edge of said first region; and introducing saiddopant into said second region to establish predetermined electricalcharacteristics within said second region, said guard layer inhibitingintroduction of said dopant into said peripheral portion, therebyleaving a transition strip within said second region and along said edgeof said first region.
 2. The method of claim 1 wherein said step offorming said guard layer includes patterning a conductive material toreside on said peripheral portion of said second region, said methodfurther comprising a step of forming an electrical connection to saidguard layer such that said guard layer is coupled to a source of a fixedvoltage.
 3. The method of claim 1 further comprising a step of formingfield oxide within said first region, thereby providing a field oxideregion, said guard layer being formed along a plurality of sides of saidsecond region such that said guard layer resides along an entireboundary between said field oxide region and said second region.
 4. Themethod of claim 3 wherein said second region is a source/drain region ofa transistor.
 5. The method of claim 1 wherein said step of selectingsaid circuit layout includes designing a circuit layout for aphotodetection circuit that utilizes CMOS technology, said first regionbeing a field oxide region.
 6. The method of claim 1 further comprisinga step of forming an active layer on said substrate to provide aphotodiode region that overlays said substrate.
 7. The method of claim 5wherein said step of forming said guard layer includes depositingelectrically conductive material to surround a photodiode region, saidphotodiode region being said second region.
 8. The method of claim 7further comprising a step of connecting said guard layer to a source ofa fixed voltage, thereby forming a steady-state guard layer.
 9. Themethod of claim 1 wherein said step of forming said guard layer includesoverlapping said guard layer onto a peripheral portion of said firstregion.
 10. The method of claim 1 wherein said step of forming saidguard layer includes patterning conductive material to define a gate ofa MOSFET and to provide said guard layer along an interface between asource/drain region of said MOSFET and a field oxide region, saidtransition strip thereby isolating said source/drain region from saidfield oxide region.
 11. The method of claim 10 wherein said step ofpatterning conductive material includes electrically connecting saidguard layer to said gate.
 12. A method of forming an active area diodefor an imaging circuit comprising steps of: forming a field oxide regionon a substrate, said field oxide region having an edge that at leastpartially defines a geometry of an active area diode region; forming aconductive layer on said substrate such that said conductive layergenerally follows a contour of said edge of said field oxide region,while extending onto a peripheral portion of said active area dioderegion; and modifying electrical characteristics of said active areadiode region such that said active area diode region is responsive tolight energy, said conductive layer inhibiting said modification of saidelectrical characteristics within said peripheral region.
 13. The methodof claim 12 further comprising a step of connecting said conductivelayer to a constant source of voltage.
 14. The method of claim 12wherein said step of modifying said electrical characteristics includesdiffusing a dopant into said active area diode region.
 15. The method ofclaim 12 wherein said step of forming said conductive layer includespatterning polysilicon to extend onto peripheral portions of each ofsaid field oxide region and said active area diode region.
 16. A methodof forming an overlay photodiode structure of an imaging circuitcomprising steps of: forming a field oxide region on a substrate, saidfield oxide region having an edge that at least partially defines ageometry of an active region of a transistor; forming a conductive layeron said substrate such that said conductive layer generally follows acontour of said edge of said field oxide region, while extending onto aperipheral portion of said active region; forming said transistor onsaid substrate, including doping said active region; and forming atleast one overlayer to provide a photodiode arrangement that overlayssaid substrate, said photodiode arrangement being responsive to lightenergy and being electrically coupled to said transistor.
 17. The methodof claim 16 wherein said step of forming said transistor includesfabricating said transistor with at least one other transistor toprovide a multi-transistor imaging pixel within an array of adjacentpixels having said overlay photodiode structure.
 18. An integratedcircuit having CMOS transistors comprising: a substrate; a first regionalong a surface of said substrate, said first region having an edge,said first region being a field oxide region; a second region along saidsurface, said second region having a periphery which is adjacent to saidedge of said first region; a guard layer residing on said surface andfollowing adjacency of said first and second regions, said guard layerextending onto only a peripheral portion of said second region; whereinsaid second layer includes said peripheral transition portion that issubstantially free of a selected dopant and includes a remaining activeportion in which said selected dopant is implanted, said peripheraltransition portion being defined by said guard layer extending onto saidsecond region.
 19. The integrated circuit of claim 18 wherein said guardlayer has a fixed connection to a source of a constant voltage.
 20. Theintegrated circuit of claim 19 wherein said second region is aphotodiode region.
 21. The integrated circuit of claim 18 wherein saidsecond region is a source/drain region of a MOSFET, said guard layerbeing contiguous with a gate of said MOSFET.